A 400 Point Mini Solderless Breadboard is a compact, reusable plastic prototyping board containing 400 tie points (300 signal tie-points and 100 power rail tie-points) designed for building and testing temporary electronic circuits without any soldering.

Breadboard 8.2X5.5X0.85CM

400 TIE POINT

Total Tie Points: 400 individual contact holes spaced at a standard 0.1-inch (2.54 mm) pitch.
IC-Circuit Area: 300 main tie-points divided into two blocks of 5 rows by 30 columns, separated by a central divider ideal for mounting DIP (Dual Inline Package) integrated circuits. 
Power Rails: Two distribution strips providing 4 separate power/ground rails (typically marked with red/blue lines) running along the sides. 
Dimensions: Approximately 8.2 cm x 5.3 cm to 8.5 cm x 5.5 cm. 
Backing: Equipped with a self-adhesive peel-and-stick tape on the bottom to mount it securely onto a project base or testing platform